Application of Ultrasonic Power Amplifier in MEMS Ultrasonic Testing

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The success of MEMS sensors mainly depends on the packaging technology, including SIP (system-in-package), WLP (wafer-level packaging), three-dimensional through-silicon via (TSV) and other technologies. The use of three-dimensional stacking technology can integrate the miniaturized sensor mechanical components and Other microelectronic components are integrated, and different packaging forms are selected according to different applications.

For most MEMS sensors, if they want it to be used normally and function properly, it is necessary to deform and displace the internal movable microstructure within an appropriate range. Therefore, the modal test of MEMS requires vibration. That is, incentives are needed.

Excitation methods for MESM modal testing include magnetic excitation, thermal excitation, electrostatic excitation, piezoelectric excitation, acoustic excitation, and base excitation based on piezoelectric ceramics.

For various excitation methods of MEMS, it is very important to select the appropriate excitation device. The maximum output voltage of Antai ultrasonic power amplifier is 10kV, the maximum output current is 64Ap, the maximum output power is 10kW, and the voltage gain is adjustable by numerical control, which can meet the needs of different excitation indicators.

The working principle of ultrasonic power amplifier in MEMS ultrasonic testing:

The core device of high-frequency MEMS is mainly the piezoelectric control device, which uses its piezoelectric effect and inverse piezoelectric effect to realize the conversion of mechanical energy and electrical energy. The piezoelectric control device generates high-frequency vibration under the excitation of high-frequency electrical signals, thereby stimulating Ultrasound, using piezoelectric control devices to receive ultrasonic waves and convert them into electrical signals, so as to realize the conversion of ultrasonic signals.

High-frequency MEMS is generally driven by exciting oscillation, which is excited by a square wave or pulse vibrator. Since high-frequency MEMS requires a current above 1MHz and a voltage of 30Vp-p, the output voltage of the signal generator is low and the load capacity is weak. , so it needs to be used with an ultrasonic power amplifier for experimental testing.

system-in-package

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